Robot for Semiconductor

MTCR41604-Axis Cylindrical Coordinate Clean Robot

Product Video

Usage Environment/Specifications

Product Profile

Model Name	MTCR4160
Environment	Clean room atmosphere
Arm	Twin arm
Operating Range	315mm (3rd joint center)
Vertical Stroke	300mm / 400mm / 500mm
Payload Capacity	4kg (calculated for the arm 3rd joint)

List of Product Model

Product Model		Vertical Stroke
Standard	MTCR4160-300-AM	300mm
	MTCR4160-400-AM	400mm
	MTCR4160-400-AM	500mm

The image above and the video are of MTCR4160-300-AM.

Characteristics

Designed for handling 300mm wafers in a production line or inspection line of semiconductor.
High-speed handling by AC servo motor and superior cost performance compared to MTHR type.
Certified CE marking.
Execution of origin search is not required by using the servo motors with absolute encoders.

Arm lineup: 160mm, 200mm
Twin-arm reduces the wafer swap time.
Base or flange mounting type is selectable.
Motion monitoring is available.
RS232C and parallel photo I/O are standard for control.
AC servo motor installed in all axes.
High-speed, high-accuracy wafer handlingby S-curved speed control.
Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector.
End-effector material: CFRP, Al, ceramic, or others.
Optimal end-effector is selectable according to the carrying object and line layout.

Standard Specifications

Example of standard specifications with JEL standard end-effector (vacuum type)
Specifications of Robot
Robot Model	MTCR4160-300-AM
Carrying Object	Wafer up to 300mm
Wafer Holding Method	By vacuum suction
Robot Model Type	Cylindrical coordinate type	Control Axis	4-axis
Motor Type	AC servo motor
Operating Range	From the robot center to the wafer center	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Operating Range	575mm	340deg	300mm
Carrying Speed(Ave.)	Arm (R-axis)	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Carrying Speed(Ave.)	850mm/sec	340deg/sec	330mm/sec
Carrying Speed (Max.)	Arm (R-axis)	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Carrying Speed (Max.)	1800mm/sec	550deg/sec	500mm/sec
Resolution	Arm (R-axis)	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Resolution	Below 9.82µm	0.0015deg	1.96µm
Handling level	674.5mm (Base mounting level to end-effector level)
Repeatability	Within ±0.1mm
Cleanliness	ISO Class 2 (at wafer transfer level when exhausting driving part)
Utility	Power: AC200V single phase ±10% 3kVA; Vacuum: -53kPa or more
Specifications of Controller
Controller Model	C5000S series
Interface	RS232C and parallel photo I/O

Outline Drawing (Standard)

Option

End-Effector

Model Name	Size of Carrying Object	End-effector Type (Thickness)	Wafer Holding Method
SC-IW-200	3 inch, 100mm to 200mm	I-shape (2mm)	Vacuum suction
SC-IW-240	3 inch, 100mm to 300mm	I-shape (2mm)	Vacuum suction
SC-YW-200	100mm to 200mm	Y-shape (2mm)	Vacuum suction
SC-YW-227	100mm to 300mm	Y-shape (2mm)	Vacuum suction
SC-YW-240	100mm to 300mm	Y-shape (2mm)	Vacuum suction
3D-02229	150mm～300mm	Y-shape (2mm)	Vacuum suction
SC3-YW-240	300mm	Y-shape (3mm)	Vacuum suction
3D-01661	300mm	Y-shape (3mm)	Vacuum suction
SC3-IW-240	300mm	I-shape (3mm)	Vacuum suction

*The table above shows the specifications of JEL standard end-effectors. The other specifications are available.
*Click the items below to review the end-effectors other than JEL standard types.

Other Option

Product Lineup

Icon guide

...Atmosphere
...Vacuum
...Waterproof
...Single arm
...Twin arm
...Thin wafer
...CE marking
...JEL's standard spec.
...KCs marking