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3D-02229Vacuum Type End-Effector
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Usage Environment/Specifications
Product Profile
Model Name | 3D-02229 |
Carrying Size | 150 to 300mm |
Carrying Object | Mainly silicon wafer |
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Characteristics
Y-shaped vacuum suction type end-effector, suitable for handling wafer from 150 to 300mm (Random access is available).
Used extensively for atmospheric robot, the end-effector holds the backside of wafer by vacuum suction (negative pressure).
Conductive Teflon coating on the surface of end-effector protects against damage from charging.
Standard Specifications
Carrying Object |
SEMI standard 150 to 300mm (Mainly silicon wafer) |
Material |
High purity alumina ceramic sintered body |
Surface Treatment |
Conductive Teflon coating |
Wafer Holding Method |
Vacuum suction |
Total Length |
242mm |
Thickness |
2mm |
Please contact us for the detailed specifications.
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