JEL-Leading Manufacturer of Clean Robot

Robot for Semiconductor

GTCR5280 (For 300mm wafer)5-Axis Horizontal and Multi-Joint Type Clean Robot


Product Video

Usage Environment/Specifications

Product Profile

Model NameGTCR5280
EnvironmentClean room atmosphere
ArmSingle arm
Operating Range553mm (3rd joint center)
Vertical Stroke300mm
Payload CapacityBelow 4kg (calculated for the arm 3rd joint)

List of Product Model

Product ModelVertical Stroke
  • The image above and the video are of GTCR5280-300-AM.


A twin end-effector mounted on its single-arm has the same function as a twin-arm robot.
Designed for handling 300mm wafers in a production line or inspection line of semiconductor.
Execution of origin search is not required by using the servo motors with absolute encoders.

  • 3 FOUP access is available without a track.
  • Twin end-effector reduces the wafer swap time.
  • Base or flange mounting type is selectable.
  • Motion monitoring is available.
  • RS232C and parallel photo I/O are standard for control.
  • AC servo motors with absolute encoders installed in all axes.
  • High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control.
  • Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector.
  • End-effector material: CFRP, Al, ceramic, or others.
  • Optimal end-effector is selectable according to the carrying object and line layout.

Standard Specifications

Example of standard specifications with JEL standard end-effector (vacuum type)
Specifications of Robot
Robot Model GTCR5280-300-AM
Carrying Object Up to 300mm silicon wafer
Wafer Holding Method By vacuum suction
Robot Model Type Horizontal and multi-joint type Control Axis 5-axis
Motor Type AC servo motor
Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
953mm 335deg 300mm
Carrying Speed Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
833mm/sec 250deg/sec 300mm/sec
Repeatability Within ±0.1mm
Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part)
Utility Power: AC200V Single phase ±10% 2kVA; Vacuum: -53kPa or more
Mass Approx. 50kg
Specifications of Controller
Controller Model C5000S series
Interface RS232C and parallel photo I/O
Outline Drawing (Standard)


Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method
SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction
SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction
SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction
SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction
SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction
3D-02229 150mm~300mm Y-shape (2mm) Vacuum suction
SC3-YW-240 300mm Y-shape (3mm) Vacuum suction
3D-01661 300mm Y-shape (3mm) Vacuum suction
SC3-IW-240 300mm I-shape (3mm) Vacuum suction

*The table above shows the specifications of JEL standard end-effectors. The other specifications are available.
*Click the items below to review the end-effectors other than JEL standard types.

Other Option

Product Lineup

Icon guide
  • ...Atmosphere
  • ...Vacuum
  • ...Waterproof
  • ...Single end-effector
  • ...Twin end-effector
  • ...Thin wafer
  • ...CE marking
  • ...JEL's standard spec.
  • ...KCs marking