Aligner
SAL2061 (Edge-grip type)Wafer Aligner
Product Video |
Usage Environment/SpecificationsProduct Profile
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Characteristics
Designed for aligning wafers in a production line or inspection line of semiconductor.
- Minimized footprint and designed for aligning small wafer.
- High-speed, high-accuracy centering and flat/notch locating of small wafer.
Standard Specifications
| Carrying Object | JEIDA standard 150 mm silicon wafer |
|---|---|
| Positioning Accuracy | Centering: Within ±0.3 mm Orientation flat locating: Within ±0.2 deg |
| Positioning Time | Orientation flat search: Within 4 sec (Wafer pick-up/placing time excluded) |
| Sensor | Red LED transmissive sensor |
| Wafer Holding Method | By edge grip |
| Cleanliness | 0.1 µm/cf Class 1 (at wafer transfer level when exhausting driving part) |
| Driving method | Small size stepping motors at each axis (internal motor driver) |
| Utility | Power: DC24V±10% 2A |
Icon guide
- ...Atmosphere
- ...Vacuum
- ...Waterproof
- ...Thin wafer
- ...CE marking
- ...JEL's standard spec.
- ...KCs marking