JEL-Leading Manufacturer of Clean Robot



Robot for Semiconductor

MCR3160C3-Axis Cylindrical Coordinate Clean Robot

MCR3160C-300-AM

Usage Environment/Specifications

Product Profile

Model NameMCR3160C
EnvironmentClean room atmosphere
ArmSingle arm
Operating Range400mm (3rd joint center)
Vertical Stroke300mm / 400mm / 500mm
Payload Capacity4kg (calculated for the arm 3rd joint)

List of Product Model

Product ModelVertical Stroke
StandardMCR3160C-300-AM300mm
 MCR3160C-400-AM400mm
 MCR3160C-500-AM500mm
  • The image above is of MCR3160C-300-AM.

Characteristics

Designed for handling 300mm wafers in a production line or inspection line of semiconductor.
High-speed handling by AC servo motor and superior cost performance compared to MHR type.
Execution of origin search is not required by using the servo motors with absolute encoders.

  • Base or flange mounting type is selectable.
  • Motion monitoring is available.
  • RS232C and parallel photo I/O are standard for control.
  • AC servo motors with absolute encoders installed in all axes.
  • High-speed, high-accuracy wafer handlingby S-curved speed control.
  • Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector.
  • End-effector material: CFRP, Al, ceramic, or others.
  • Optimal end-effector is selectable according to the carrying object and line layout.

Standard Specifications

Example of standard specifications with JEL standard end-effector (vacuum type)
Specifications of Robot
Robot Model MCR3160C-300-AM
Carrying Object Wafer up to 300mm
Wafer Holding Method By vacuum suction
Robot Model Type Cylindrical coordinate type Control Axis 3-axis
Motor Type AC servo motor
Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
567.7mm 340deg 300mm
Carrying Speed(Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
1000mm/sec 360deg/sec 350mm/sec
Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
1800mm/sec 580deg/sec 530mm/sec
Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
Below 9.82µm 0.0015deg 1.96µm
Handling level 639mm (Base mounting level to end-effector level)
Repeatability Within ±0.1mm
Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part)
Utility Power: AC200V single phase ±10% 3kVA; Vacuum: -53kPa or more
Specifications of Controller
Controller Model C5000S series
Interface RS232C and parallel photo I/O
Outline Drawing (Standard)
MCR3160C-300-AM

Option

End-Effector

*Click the items below to review the end-effectors other than JEL standard types.

Other Option

Product Lineup


Icon guide
  • ...Atmosphere
  • ...Vacuum
  • ...Waterproof
  • ...Single arm
  • ...Twin arm
  • ...Thin wafer
  • ...CE marking
  • ...JEL's standard spec.
  • ...KCs marking