JEL-Leading Manufacturer of Clean Robot

Robot for Semiconductor

GCR4280 (For large diameter wafer)4-Axis Horizontal and Multi-Joint Type Clean Robot


Product Video

Usage Environment/Specifications

Product Profile

Model NameGCR4280
EnvironmentClean room atmosphere
ArmSingle arm
Operating Range553mm (3rd joint center)
Vertical Stroke300mm / 420mm
Payload CapacityBelow 4kg (calculated for the arm 3rd joint)

List of Product Model

Product ModelVertical Stroke
  • The image above and the video are of GCR4280-300-AM.


Designed for handling large diameter wafer in a production line or inspection line of semiconductor.
Execution of origin search is not required by using the servo motors with absolute encoders.

  • 3 FOUP access is available for robot only (for 300mm wafer). 2 FOUP access is available without a track for 450mm wafer.
  • Base or flange mounting type is selectable.
  • Motion monitoring is available.
  • AC servo motors with absolute encoders installed in all axes.
  • High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control.
  • Wafer holding: end-effector with vacuum suction, passive edge, or edge grip.
  • End-effector material: CFRP, Al, ceramic, or others.
  • Optimal end-effector is selectable according to the carrying object and line layout.

Standard Specifications

Example of standard specifications with JEL standard end-effector (vacuum type) for 300mm wafer.
Specifications of Robot
Robot Model GCR4280-300-AM
Carrying Object SEMI standard up to 450mm silicon wafer, small glass substrate
Wafer Holding Method By vacuum suction
Robot Model Type Horizontal and multi-joint type Control Axis 4-axis
Motor Type AC servo motor
Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
863mm 335deg 300mm
Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
900mm 250deg/sec 300mm/sec
Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
1300mm 350deg/sec 450mm/sec
Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
0.0018deg 0.0015deg 1.96µm
Handling level 669mm (Base mounting level to end-effector level)
Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part)
Repeatability Within ±0.1mm
Utility Power: AC200V single phase ±10% 2kVA; Vacuum: -53kPa or more
Specifications of Controller
Controller Model C5000S series
Interface RS232C and parallel photo I/O
Outline Drawing (Standard)



*Click the items below to review the end-effectors other than JEL standard types.

Other Option

Product Lineup

Icon guide
  • ...Atmosphere
  • ...Vacuum
  • ...Waterproof
  • ...Single arm
  • ...Twin arm
  • ...Thin wafer
  • ...CE marking
  • ...JEL's standard spec.
  • ...KCs marking