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Flip UnitWrist-block Unit
Product Video |
Usage Environment/SpecificationsProduct Profile
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Characteristics
Suitable for the system or robot that requires treatment of both sides of wafer.
- Compact and lightweight design: Minimized by 50% compared to the conventional model.
- High-speed flip: Speed improved by 20% for 300mm wafer, by 50% for smaller wafers, compared to the conventional mode
- Low vibration: Newly developed motor driver and control system enable low vibration
- Vacuum suction, edge grip, or Bernoulli is available.
Standard Specifications
| Carrying Object | 2, 3inch, 100 to 300mm wafer (*Also available for 450mm wafer. Contact us for the detailed specifications.) |
|---|---|
| Operating Range | 190deg |
| Carrying Speed (Ave.) | 180deg/sec (300mm wafer) |
| Carrying Speed (Max.) | 300deg/sec (300mm wafer) |
| Wafer Holding Method | End-effector with vacuum suction, edge grip, or Bernoulli |
| Utility | Power: DC24V (Supplied from robot) |
Contact us for the detailed specifications.
Icon guide
- ...Atmosphere
- ...Vacuum
- ...Waterproof
- ...Single arm
- ...Twin arm
- ...Thin wafer
- ...CE marking
- ...JEL's standard spec.
- ...KCs marking