JEL dedicated website for SEMICON exhibition robots
SAL2681 (Edge-grip type)Wafer Aligner
Product Video
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Usage Environment/Specifications
Product Profile
| Product Model | SAL2681 |
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| Environment | Clean room atmosphere |
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| Wafer Size | 150 mm, 200 mm |
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| Carrying Object | Silicon wafer |
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- The image above and the video are of SAL2681.
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Characteristics
Designed for aligning wafers in a production line or inspection line of semiconductor.
- Minimized footprint and designed for aligning small wafer.
- High-speed, high-accuracy centering and flat/notch locating of small wafer.
Standard Specifications
| Carrying Object |
SEMI standard 150 mm silicon wafer (Flat),
SEMI standard 200 mm silicon wafer (Notch) |
| Positioning Accuracy |
Centering: Within ±0.2 mm
Notch locating: Within ±0.2 deg |
| Positioning Time |
Notch search : 15 sec (Wafer pick-up/placing time excluded) |
| Sensor |
Red LED transmissive sensor |
| Wafer Holding Method |
By edge grip |
| Cleanliness |
0.1 µm/cf Class 1 (at wafer transfer level when exhausting driving part) |
| Driving method |
Small size stepping motors at each axis (internal motor driver) |
Product Lineup
