JEL-Leading Manufacturer of Clean Robot



JEL dedicated website for SEMICON exhibition robots

  • SEMICON JAPAN 2021 HYBRID title

click here for GTFR details page click here for SAL-HV details page. click here for KHR details page.
click here for STCR details page. click here for SAL details page. click here for MTCR details page.

New Aligner "SAL3000HV Series" (Full auto-adjustment version)

New low head SAL-HV (Multi work aligner)Wafer Aligner

New low head SAL-HV

Product Video

Usage Environment/Specifications


Product Profile

Product Model SAL38C3HV
Environment Clean room atmosphere
Wafer Size 200 to 300 mm
Carrying Object Transparent, translucent, or silicon wafer
  • The image is of New low head SAL-HV.
  • The video is of full auto-adjustment software "JEL ALIGN TOOL".

Characteristics

Full auto-adjustment software  JEL ALIGN TOOL comes with Aligner SAL3000HV series that have been released on December 14, 2016.
Downtime can be reduced significantly.
*Click to go to the page of New Aligner "SAL3000HV Series" (Full auto-adjustment version)(*).
(*) Please note that this tool (software) is not for guaranteeing the positioning accuracy after adjustment. Make sure to check the positioning accuracy by using the customer’s inspection device at customer’s side.

Aligner available for any material of wafer for 200 to 300 mm wafer

  • High-speed, high-accuracy centering and flat/notch locating are available for silicon wafer with BG tape as well as silicon, transparent, or translucent wafer.
  • Equipped with JEL-developed image sensor, and internal motor driver and controller.
  • ウェーハサイズ、材質にあわせて保持方法の変更可能
  • Available for non-SEMI standard notch or flat
  • ウェーハ持ち直し動作が可能な昇降ユニットをオプションで取付可能
  • 多種多様なウェーハのアライメントが可能

Standard Specifications

Carrying Object SEMI standard 200 to 300 mm wafer (Transparent, translucent, silicon)
Positioning Time Centering : 1.5 sec (Wafer pick-up/placing time excluded)
Positioning Accuracy Centering: Within ±0.1 mm
Flat locating/Notch locating: Within ±0.1 deg
Sensor LED light + wafer edge detection with image sensor unit
Wafer Size Change By command control or switch
Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part)
Driving Method 2-phase stepping motor (for 3 axes)
Internal motor driver, controller
Utility Power: DC24V±10% 3A
Vacuum: -53 kPa or more
Outline Drawing
SAL38C3HV


click here for GTFR details page click here for SAL-HV details page. click here for KHR details page.
click here for STCR details page. click here for SAL details page. click here for MTCR details page.

  • SEMICON JAPAN 2021 HYBRID title

Product Lineup


Icon guide
  • ...Atmosphere
  • ...Vacuum
  • ...Waterproof
  • ...Thin wafer
  • ...CE marking
  • ...JEL's standard spec.
  • ...KCs marking