JEL-Leading Manufacturer of Clean Robot



JEL dedicated website for SEMICON exhibition robots

  • SEMICON TAIWAN 2021 title

click here for GTFR details page click here for SAL-HV details page. click here for KHR details page.
click here for STCR details page. click here for SAL details page. click here for MTCR details page.

GTFR5280 (For 300 mm wafer)5-Axis Horizontal and Multi-Joint Type Clean Robot

GTFR5280-320-DM

Product Video

Usage Environment/Specifications

Usage Environment/Specifications

Product Profile

Model NameGTFR5280
EnvironmentClean room atmosphere
ArmSingle arm
Operating Range553 mm (3rd joint center)
Vertical Stroke320 mm
Payload CapacityBelow 4kg (calculated for the arm 3rd joint)

List of Product Model

Product ModelVertical Stroke
StandardGTFR5280-320-DM320 mm
  • The image above and the video are of GTFR5280-320-DM.

Characteristics

5-Axis horizontal and multi-joint type clean robot for 300 mm wafer.
A twin end-effector mounted on its single-arm has the same function as a twin-arm robot.
Designed for handling wafers in EFEM.
Compared to our conventional GTCR model, the cycle time is improved by reducing the operation prohibited area and the influence of speed limit.

  • 3 FOUP access is available without a track.
  • Twin end-effector reduces the wafer swap time.
  • AC servo motors with absolute encoders installed in all axes. (Batteryless)
  • Wafer holding: end-effector with vacuum suction, passive edge, edge grip.
  • Optimal end-effector is selectable according to the carrying object and line layout.

Standard Specifications

Example of standard specifications with JEL standard end-effector (vacuum type)
Specifications of Robot
Robot Model GTFR5280-320-DM
Carrying Object Up to 300 mm silicon wafer
Wafer Holding Method By vacuum suction
Robot Model Type Horizontal and multi-joint type Control Axis 5-axis
Motor Type AC servo motor (Batteryless)
Operating Range From the robot center to the wafer center Vertical Stroke (Z-axis)  
893 mm 320 mm  
Carrying Speed (Ave.) Arm (R-axis) Vertical Stroke (Z-axis)  
900 mm/sec(when cylindrical operation) 320 mm/sec  
Carrying Speed (Max.) Arm (R-axis) Vertical Stroke (Z-axis)  
1,500 mm/sec(when cylindrical operation) 540 mm/sec  
Repeatability Within ±0.05 mm
Cleanliness ISO Class 1
Utility Power: AC200V Single phase ±10% 2 kVA; Vacuum: -75 kPa or more
Mass Approx. 80 kg
Outline Drawing (Standard)
GTFR5280-320-DM

Option

End-Effector
Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method
SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction
SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction
SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction
SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction
SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction
3D-02229 150mm~300mm Y-shape (2mm) Vacuum suction
SC3-YW-240 300mm Y-shape (3mm) Vacuum suction
3D-01661 300mm Y-shape (3mm) Vacuum suction
SC3-IW-240 300mm I-shape (3mm) Vacuum suction

*The table above shows the specifications of JEL standard end-effectors. The other specifications are available.
*Click the items below to review the end-effectors other than JEL standard types.

Other Option


click here for GTFR details page click here for SAL-HV details page. click here for KHR details page.
click here for STCR details page. click here for SAL details page. click here for MTCR details page.

  • SEMICON TAIWAN 2021 title

Product Lineup


Icon guide
  • ...Atmosphere
  • ...Vacuum
  • ...Waterproof
  • ...Single end-effector
  • ...Twin end-effector
  • ...Thin wafer
  • ...CE marking
  • ...JEL's standard spec.
  • ...KCs marking