JEL-Leading Manufacturer of Clean Robot

Robot for Semiconductor

MTCR4280 (For large diameter wafer)4-Axis Cylindrical Coordinate Clean Robot


Product Video

Usage Environment/Specifications

Product Profile

Model NameMTCR4280
EnvironmentClean room atmosphere
ArmTwin arm
Operating Range545mm (3rd joint center)
Vertical Stroke420mm

List of Product Model

Product ModelVertical Stroke
  • The image above and the video are of MTCR4160-300-AM (For 300mm wafer).


Designed for handling large diameter wafer in a production line or inspection line of semiconductor.
High-speed handling by AC servo motor and superior cost performance compared to MTHR type.
Execution of origin search is not required by using the servo motors with absolute encoders.

  • Twin-arm reduces the wafer swap time.
  • Base or flange mounting type is selectable.
  • Motion monitoring is available.
  • RS232C and parallel photo I/O are standard for control.
  • AC servo motor installed in all axes.
  • High-speed, high-accuracy wafer handling by S-curved speed control.
  • Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector.
  • End-effector material: CFRP, Al, ceramic, or others.
  • Optimal end-effector is selectable according to the carrying object and line layout.

Standard Specifications

Example of standard specifications with JEL standard end-effector (vacuum type) for 450mm wafer.
Specifications of Robot
Robot Model MTCR4280-420-AM
Carrying Object 450mm silicon wafer (notch type)
Wafer Holding Method By vacuum suction
Robot Model Type Cylindrical coordinate type Control Axis 4-axis
Motor Type AC servo motor
Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
995mm 340deg 420mm
Carrying Speed Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
540mm/sec 170deg/sec 200mm/sec
Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
Below 11.5µm 0.0013deg 1.96µm
Repeatability Within ±0.1mm
Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part)
Utility Power: AC200V; Vacuum : -53kPa or more
Outline Drawing (Standard)



*Click the items below to review the end-effectors other than JEL standard types.

Other Option

Product Lineup

Icon guide
  • ...Atmosphere
  • ...Vacuum
  • ...Waterproof
  • ...Single arm
  • ...Twin arm
  • ...Thin wafer
  • ...CE marking
  • ...JEL's standard spec.
  • ...KCs marking