System
SSY-10000 (Table-top loader system for 100mm wafer)Wafer Transfer System
Product Video
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Usage Environment/Specifications
Product Profile
Product Model | SSY-10000 |
Environment | Clean room atmosphere |
Operating Range | 225mm (Distance to wafer center) |
Wafer Size | Up to 100mm |
Carrying Object | Glass, sapphire, SiC, or GaN or other wafers |
Contact us for the detailed specifications. |
Payload Capacity | 0.1kg (Wafer only) |
- The image above and the video are of SSY-10000 (Table-top loader system for 100mm wafer).
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Characteristics
For various types of wafers; 2, 3 inch, 100mm glass, sapphire, SiC, or GaN or others.
Customization is available.
- Compact system integrating wafer inspection stage into wafer handling system.
- Long stroke of 190mm X-axis and 200mm Y-axis. Wafer stage position can be manually adjusted with a handle.
- Twin end-effector reduces the wafer swap time.
- Low-cost & high-performance system combining robot and passive type alignment stage.
Standard Specifications
Carrying Object |
Up to 100mm wafer (glass, sapphire, SiC, or GaN or others)
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Operating Range |
From the robot center to the wafer center |
Rotation Angle (Theta-axis) |
Vertical Stroke (Z-axis) |
225mm |
360deg |
150mm |
Carrying Speed (Ave.) |
Arm (R-axis) |
Rotation Angle (Theta-axis) |
Vertical Stroke (Z-axis) |
225mm/sec |
500deg/sec |
200mm/sec |
Carrying Speed (Max.) |
Arm (R-axis) |
Rotation Angle (Theta-axis) |
Vertical Stroke (Z-axis) |
300mm/sec |
700deg/sec |
300mm/sec |
Wafer Holding Method |
By vacuum suction |
Repeatability |
Within ±0.1mm |
Cleanliness |
ISO Class 2 (at wafer transfer level when exhausting driving part) |
Mass |
Approx. 15kg (Robot) |
Utility |
Power: AC100V±10% 0.2kVA Vacuum: -53kPa or more |
Option
Other Option
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