JEL-Leading Manufacturer of Clean Robot



Robot for Semiconductor

MTCR4160 (Tape frame handling) 4-Axis Cylindrical Coordinate Clean Robot

MTCR4160-300-AM(Tape frame handling)

Product Video

Usage Environment/Specifications

Product Profile

Model NameMTCR4160
EnvironmentClean room atmosphere
ArmTwin arm
Operating Range315 mm (3rd joint center)
Vertical Stroke300 mm
Payload CapacityBelow 5kgf (calculated for the arm 3rd joint)

List of Product Model

Product ModelVertical Stroke
MTCR4160-300-AM300 mm
  • The image and the video are of MTCR4160-300-AM (Tape frame handling).

Characteristics

High-accuracy handling of tape frames. Accessible to all slots in the cassette with normal pitch by random access with clip-type end-effector.
Available for tape frames for up to 300 mm wafers.
Visualization of operation by MECHATROLINK-III.

  • Arm lineup: 160 mm, 200 mm, 240 mm, 280 mm
  • Twin-arm reduces the wafer swap time.
  • Base or flange mounting type is selectable according to the customer’s system layout.
  • Motion monitoring is available.
  • RS232C and parallel photo I/O are standard for control.
  • AC servo motors with absolute encoders installed in all axes
  • High-speed, high-accuracy wafer handling by S-curved speed control.
  • Presence sensor of tape frame during handling is available (option).
  • Shock sensor to cushion the shock in a case of a crash is available (option).

Standard Specifications

(*) Standard specifications of MTCR4160-300-AM (Tape frames for 200 mm to 300 mm wafers)
Specifications of Robot
Robot Model MTCR4160-300-AM
Carrying Object 200 mm to 300 mm wafers (Tape frames for 200 mm to 300 mm wafers)
(Other sizes of tape frames are option.)
Wafer Holding Method By edge grip (driven by pneumatic cylinder)
Robot Model Type Cylindrical coordinate type Control Axis 4-axis
Motor Type AC servo motor
Operating Range (*) From robot center to wafer center Rotation Angle (θ-axis) Vertical Stroke (Z-axis)
585 mm 340 deg 300 mm
Carrying Speed (*) Arm (R-axis) Rotation Angle (θ-axis) Vertical Stroke (Z-axis)
360 mm/sec 140 deg/sec 180 mm/sec
Resolution (*) Arm (R-axis) Rotation Angle (θ-axis) Vertical Stroke (Z-axis)
10.0 µm or less 0.0015 deg 1.96 µm
Repeatability Within ±0.1 mm
Cleanliness ISO Class 2 or less (at wafer transfer level when exhausting driving area)
Utility Power: AC200V±10% 3 kVA
(For both end-effectors) Air (Positive pressure): 0.5 MPa or more 10 NL/min or more
Mass Robot main body: Approx. 50 kg
Specifications of Controller
Controller Model C5000S series
Interface RS232C and parallel photo I/O
Outline Drawing (Standard)
MTCR4160-300-AM (Tape frame handling)

Option

Other Option

Product Lineup


Icon guide
  • ...Atmosphere
  • ...Vacuum
  • ...Waterproof
  • ...Single arm
  • ...Twin arm
  • ...Thin wafer
  • ...CE marking
  • ...JEL's standard spec.
  • ...KCs marking