Robot for Semiconductor
GTCR5280 (For 300mm wafer)5-Axis Horizontal and Multi-Joint Type Clean Robot
Product Video
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Usage Environment/Specifications
Product Profile
Model Name | GTCR5280 |
Environment | Clean room atmosphere |
Arm | Single arm |
Operating Range | 553mm (3rd joint center) |
Vertical Stroke | 300mm |
Payload Capacity | Below 4kg (calculated for the arm 3rd joint) |
List of Product Model
Product Model | Vertical Stroke |
Standard | GTCR5280-300-AM | 300mm |
- The image above and the video are of GTCR5280-300-AM.
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Characteristics
A twin end-effector mounted on its single-arm has the same function as a twin-arm robot.
Designed for handling 300mm wafers in a production line or inspection line of semiconductor.
Execution of origin search is not required by using the servo motors with absolute encoders.
- 3 FOUP access is available without a track.
- Twin end-effector reduces the wafer swap time.
- Base or flange mounting type is selectable.
- Motion monitoring is available.
- RS232C and parallel photo I/O are standard for control.
- AC servo motors with absolute encoders installed in all axes.
- High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control.
- Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector.
- End-effector material: CFRP, Al, ceramic, or others.
- Optimal end-effector is selectable according to the carrying object and line layout.
Standard Specifications
Example of standard specifications with JEL standard end-effector (vacuum type)
Robot Model |
GTCR5280-300-AM |
Carrying Object |
Up to 300mm silicon wafer |
Wafer Holding Method |
By vacuum suction |
Robot Model Type |
Horizontal and multi-joint type |
Control Axis |
5-axis |
Motor Type |
AC servo motor |
Operating Range |
From the robot center to the wafer center |
Rotation Angle (Theta-axis) |
Vertical Stroke (Z-axis) |
953mm |
335deg |
300mm |
Carrying Speed |
Arm (R-axis) |
Rotation Angle (Theta-axis) |
Vertical Stroke (Z-axis) |
833mm/sec |
250deg/sec |
300mm/sec |
Repeatability |
Within ±0.1mm |
Cleanliness |
ISO Class 2 (at wafer transfer level when exhausting driving part) |
Utility |
Power: AC200V Single phase ±10% 2kVA; Vacuum: -53kPa or more |
Mass |
Approx. 50kg |
Controller Model |
C5000S series |
Interface |
RS232C and parallel photo I/O |
Option
End-Effector
Model Name |
Size of Carrying Object |
End-effector Type (Thickness) |
Wafer Holding Method |
SC-IW-200 |
3 inch, 100mm to 200mm |
I-shape (2mm) |
Vacuum suction |
SC-IW-240 |
3 inch, 100mm to 300mm |
I-shape (2mm) |
Vacuum suction |
SC-YW-200 |
100mm to 200mm |
Y-shape (2mm) |
Vacuum suction |
SC-YW-227 |
100mm to 300mm |
Y-shape (2mm) |
Vacuum suction |
SC-YW-240 |
100mm to 300mm |
Y-shape (2mm) |
Vacuum suction |
3D-02229 |
150mm~300mm |
Y-shape (2mm) |
Vacuum suction |
SC3-YW-240 |
300mm |
Y-shape (3mm) |
Vacuum suction |
3D-01661 |
300mm |
Y-shape (3mm) |
Vacuum suction |
SC3-IW-240 |
300mm |
I-shape (3mm) |
Vacuum suction |
*The table above shows the specifications of JEL standard end-effectors. The other specifications are available.
*Click the items below to review the end-effectors other than JEL standard types.
Other Option
Product Lineup